Intel and Micron

Intel wants to make your next PC perform a lot faster. It has teamed up with Micron to reveal 3D XPoint, a new memory and storage technology that the companies claim performs up to 1,000 times faster than traditional NAND flash memory solutions.

Intel says:

"The innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes."

"The performance benefits of 3D XPoint technology could also enhance the PC experience, allowing consumers to enjoy faster interactive social media and collaboration as well as more immersive gaming experiences. The non-volatile nature of the technology also makes it a great choice for a variety of low-latency storage applications since data is not erased when the device is powered off."

It may be a little while before the first PCs with the 3D XPoint memory and storage hardware inside are released. Intel will begin sampling the technology with unnamed "select customers" later in 2015 but there's no current target date for when the first products with 3D XPoint technology will ship.

Source: Intel