Intel introduces Tremont microarchitecture, which will power Surface Neo and other devices
Intel's Tremont microarchitecture will integrate with Lakefield processors to power new devices such as the Surface Neo.
What you need to know
- Intel revealed details about the new Tremont microarchitecture.
- Tremont microarchitecture has higher performance than previous generations while using little power.
- Tremont will integrate with Lakefield CPUs to power the Surface Neo and other devices.
Intel revealed details about its new Tremont microarchitecture at the Linley Fall Processor Conference today. Tremont is the latest low-power x86 CPU architecture and has a "significant performance boost over prior generations" according to Intel. Tremont will integrate with Lakefield CPUs to power the Surface Neo and other devices.
Intel states that Tremont microarchitecture brings significant IPC (instructions per cycle) gains when compared to previous generations of Intel's low-power x86 architectures. Intel designed Tremont Microarchitecture for low-power and compact packages. Intel will integrate the new microarchitecture with Lakefield processors to power devices with new form factors.
Intel Tremont Chief Architect, Stephen Robinson, expands on the new microarchitecure,
Tremont microarchitecture will integrate with Lakefield CPUs using Intel's Foveros technology. This packaging technology allows manufacturers to combine several pieces on a smaller motherboard.
Get the Windows Central Newsletter
All the latest news, reviews, and guides for Windows and Xbox diehards.
Sean Endicott brings nearly a decade of experience covering Microsoft and Windows news to Windows Central. He joined our team in 2017 as an app reviewer and now heads up our day-to-day news coverage. If you have a news tip or an app to review, hit him up at email@example.com.